Company Profile

We are a China-based fabless semiconductor company focused on the design, development, and sale of RF front-end chips. Our downstream applications include mobile smart devices, Wi-Fi products, smart homes and other IoT applications, automotive communications, and satellite communications. RF front-end chips consist of power amplifiers (PAs), low-noise amplifiers (LNAs), filters/duplexers, and switches, with PAs as the core component. We are a leading supplier of PAs and PA integrated transceiver modules. According to Frost & Sullivan, based on 2024 revenue from PAs and PA integrated transceiver modules, we ranked fifth globally and first among Chinese companies; based on 2024 shipment volume of PA and PA integrated transceiver modules, we ranked first globally.

Our products cover multiple communication standards, including 5G, 4G, 3G, 2G, Wi-Fi, and NB-IoT, and are compatible with mainstream cellular baseband communication platforms and Wi-Fi platforms. Leveraging our advanced R&D capabilities, technical expertise, and innovation in RF front-end chips, Frost & Sullivan notes that in 2020 we became the first Chinese company to launch a 5G RF front-end solution fully supporting all 5G frequency bands. In addition, we have built a high-value product portfolio in connectivity applications covering terminal use cases such as Wi-Fi, satellite communications, and automotive communications.

Our products have been widely adopted by leading mobile technology brands, and we have been approved as a qualified supplier by well-known ODM manufacturers.