

Driven by innovation, we strive to be a technology leader in wireless RF and a globally leading provider of RF solutions.

L-PAMiD is a highly integrated solution for 5G RF front-ends. It simplifies R&D and production while saving more PCB layout space. Meanwhile, it can avoid electromagnetic compatibility (EMC) and mutual interference issues through self-shielding technology. This significantly reduces the time spent on debugging and matching discrete components, thus shortening the terminal R&D cycle. All circuits are matched inside the device, delivering better RF performance.

L-PAMiD is a highly integrated solution for 5G RF front-ends. It simplifies R&D and production while saving more PCB layout space. Meanwhile, it can avoid electromagnetic compatibility (EMC) and mutual interference issues through self-shielding technology. This significantly reduces the time spent on debugging and matching discrete components, thus shortening the terminal R&D cycle. All circuits are matched inside the device, delivering better RF performance.
Learn MoreConnectivity covers technologies such as short-range connectivity, Bluetooth audio, and RF front-end systems. Lansus provides a full suite of RF connectivity solutions, including Wi-Fi and satellite connectivity.
Learn MoreLansus provides a full set of automotive-grade RF (Radio Frequency) solutions. These solutions need to meet the special requirements of automotive driving scenarios, such as vibration, high temperature, and electromagnetic interference, while complying with industry standards and regulatory requirements.
Learn MoreThe industrial sector demands the highest levels of reliability and stability from RF front-ends. We provide high-performance RF solutions for industrial IoT, smart manufacturing, and energy management scenarios, empowering industrial digital transformation.
Focusing on the research, development, innovation, and localization of RF front-end chips, the company has established a complete product portfolio that ranges from discrete components to fully integrated modules.

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